Samsung Announces Availability of its Silicon-Proven 3D IC Technologyfor High-Performance Applications

SEOUL, South Korea–(BUSINESS WIRE)–Aug 12, 2020–

Samsung Electronics Co., Ltd., a world chief in superior semiconductor expertise, immediately introduced the instant availability of its silicon-proven 3D IC packaging expertise, eXtended-Dice (X-Dice), for immediately’s most superior course of nodes. Leveraging Samsung’s through-silicon through (TSV) expertise, X-Dice permits vital leaps in velocity and energy effectivity to assist deal with the rigorous efficiency calls for of next-generation functions together with 5G, synthetic intelligence, high-performance computing, in addition to cell and wearable.

This press launch options multimedia. View the complete launch right here: https://www.businesswire.com/news/home/20200812005590/en/

Samsung Foundry’s new X-Dice expertise. (Photograph: Enterprise Wire)

“Samsung’s new 3D integration expertise ensures dependable TSV interconnections even on the cutting-edge EUV course of nodes,” stated Moonsoo Kang, senior vice chairman of Foundry Market Technique at Samsung Electronics. “We’re dedicated to bringing extra 3D IC innovation that may push the boundaries of semiconductors.”

With Samsung’s X-Dice, chip designers can take pleasure in larger flexibility to construct customized options that finest swimsuit their distinctive necessities. The X-Dice take a look at chip constructed on 7nm makes use of TSV expertise to stack SRAM on high of a logic die, releasing up area to pack extra reminiscence right into a smaller footprint. Enabled by 3D integration, the ultra-thin bundle design options considerably shorter sign paths between the dies for maximized information switch velocity and vitality effectivity. Prospects may also scale the reminiscence bandwidth and density to their desired specs.

Samsung X-Dice’s silicon-proven design methodology and move can be found now for superior nodes together with 7nm and 5nm. Constructing on the preliminary design, Samsung plans to proceed collaborating with world fabless prospects to facilitate the deployment of 3D IC options in next-generation high-performance functions.

Extra particulars on Samsung X-Dice might be introduced at Hot Chips, an annual convention on high-performance computing, which might be livestreamed Aug. 16-18.

About Samsung Electronics Co., Ltd.

Samsung evokes the world and shapes the long run with transformative concepts and applied sciences. The corporate is redefining the worlds of TVs, smartphones, wearable units, tablets, digital home equipment, community techniques, and reminiscence, system LSI, foundry and LED options. For the newest information, please go to the Samsung Newsroom at http://news.samsung.com.

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CONTACT: Editorial Contact:

Lisa Warren-Plungy

Samsung Semiconductor, Inc.

Lisa.plungy@samsung.com

KEYWORD: CALIFORNIA SOUTH KOREA UNITED STATES NORTH AMERICA ASIA PACIFIC

INDUSTRY KEYWORD: NETWORKS NANOTECHNOLOGY HARDWARE ELECTRONIC DESIGN AUTOMATION CONSUMER ELECTRONICS TECHNOLOGY SEMICONDUCTOR MOBILE/WIRELESS

SOURCE: Samsung Electronics Co., Ltd.

PUB: 08/12/2020 10:00 PM/DISC: 08/12/2020 10:00 PM

http://www.businesswire.com/news/home/20200812005590/en

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