Samsung Announces Availability of its Silicon-Proven 3D IC Technologyfor High-Performance Applications
SEOUL, South Korea–(BUSINESS WIRE)–Aug 12, 2020– Samsung Electronics Co., Ltd., a world chief in superior semiconductor expertise, immediately introduced the instant availability of its silicon-proven 3D IC packaging expertise, eXtended-Dice (X-Dice), for immediately’s most superior course of nodes. Leveraging Samsung’s through-silicon through (TSV) expertise, X-Dice permits vital leaps in velocity and energy effectivity to assist deal with the rigorous efficiency calls for of next-generation functions together with 5G, synthetic intelligence, high-performance computing, in addition to cell and wearable. This press launch options multimedia. View the complete launch right here: https://www.businesswire.com/news/home/20200812005590/en/ Samsung Foundry’s new X-Dice expertise. (Photograph: Enterprise Wire) “Samsung’s new 3D integration expertise ensures dependable TSV interconnections even on the cutting-edge EUV course of nodes,” stated Moonsoo Kang, senio